The peak of CoWoS expansion may have passed, and will return to balance in 2026

The peak of CoWoS expansion may have passed, and it is expected to return to balance in 2026. No matter how the international environment changes, the development of advanced processes and advanced packaging remains forward-looking. The research and development of next-generation PLP (panel-level packaging), CPO (common optical packaging) and glass substrate packaging applications are still in progress. For companies that have already laid out in this field, they are expected to occupy a place in the future large-scale expansion business opportunities.