TSMC plans to raise prices for advanced process wafers starting in 2026

TSMC plans to adjust the prices of its wafers produced using advanced process technology starting in 2026, with increases ranging from 5% to 10%. This new pricing strategy is primarily driven by increased capital expenditures resulting from the company's global expansion of manufacturing capacity. TSMC is expanding its wafer fabs in the United States, Japan, Germany, and other locations, with total investment in the United States increasing to $165 billion. TSMC is also investing in multiple cutting-edge process fabs and advanced packaging facilities in Taiwan, including several 2nm process fabs.