Huaxinbang established a silicon carbide chip packaging and testing production base in Hainan

Shenzhen Huaxinbang Technology Co., Ltd. plans to invest 335 million yuan in the Haikou Comprehensive Bonded Zone to build a production base for display module manufacturing and advanced packaging and testing of silicon carbide chips. The project will be implemented in phases. The initial phase will utilize approximately 8,482 square meters of space in Building 5 of the park to construct a pilot line and four AMOLED screen module production lines. Subsequently, based on development needs, the facility will be expanded to approximately 17,000 square meters, enabling full-process mass production of silicon carbide chips and adding four new module production lines, forming a complete industrial chain layout.