ChipLink Integrated Circuits launches its Silicon Carbide G2.0 technology platform, leading the power supply market for new energy vehicles and AI data centers.

ChipLink recently released its new silicon carbide G2.0 technology platform, employing advanced 8-inch manufacturing technology to achieve world-leading levels. This platform optimizes device structure and process technology to achieve high efficiency, high power density, and high reliability, making it suitable for applications such as main drives for new energy vehicles, automotive power supplies, and AI data center power supplies. In the electric drive field, the G2.0 electric drive version reduces conduction losses, increases power density, and enhances the power output and energy efficiency of new energy vehicles. In power supply scenarios, the G2.0 power supply version optimizes parasitic capacitance design, improves heat dissipation performance, reduces switching losses, and improves power conversion efficiency and system power density.