Huawei SiC Patents: Bringing Revolutionary Changes to Electronic Devices in the AI ​​Era

Huawei's SiC patent not only solves the heat dissipation problem of AI servers, but also achieves the absorption and dissipation of high-frequency electromagnetic noise by adding magnetic particles such as carbonyl iron. This integrated material is expected to improve the reliability and performance of AI accelerators, 5G/6G communication modules, and high-performance systems.