Fangqing Technology completes 1 billion yuan Pre-A round financing

Recently, Fangchuang Technology completed a 1 billion RMB Pre-A round of financing, with NIO Capital continuing to increase its investment. Fangchuang Technology focuses on decoupled distributed AI computing architecture. Its CEO, Liang Jun, has over 20 years of experience in the chip industry. He previously served as the chief architect of Huawei HiSilicon, responsible for the R&D of HiSilicon Kirin SOC chips, and later served as CTO of Cambricon, launching the first 7nm AI training chip and subsequent products.