Core Vision Microelectronics Completes RMB100 Million C Round of Financing

Core Vision Microelectronics announced the completion of a C round of financing of 100 million yuan, led by Chengxin Venture Capital and followed by 37 Interactive Entertainment. The company is a global leader in optical sensor chips, focusing on single-photon dToF three-dimensional imaging technology. Its products are used in sweepers, drones, smartphones and other fields, and have entered the automotive autonomous driving lidar market. Core Vision Microelectronics is the first chip company in the global market to mass-produce and ship SPAD dToF technology applications.