Infineon Technologies Launches New CoolSiC™ XHP™ 2 High Power Module

2024-12-20 09:20
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Infineon Technologies has launched two new CoolSiC™ XHP™ 2 high-power modules, FF2000UXTR33T2M1 and FF2600UXTR33T2M1, to meet the needs of energy-saving electrified trains. These modules combine 3.3kV CoolSiC™ MOSFET and Infineon .XT interconnect technology to provide high power density, high reliability, and optimize train operation performance.