STMicroelectronics' Packaging and Testing Innovation Center Grandly Launched in Shenzhen

The STMicroelectronics Packaging and Testing Innovation Center officially opened in the Bay Area Core Valley in the Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone in Hetao, Shenzhen. The center aims to integrate manufacturing, packaging and testing technologies, promote the deep integration of semiconductor R&D and production, and help the development of China's semiconductor industry. Senior executives of STMicroelectronics, leaders of CESI and representatives of Shenzhen Investment Holdings Co., Ltd. attended the opening ceremony.