STMicroelectronics Packaging and Test Innovation Center magnifice emissae in Shenzhen

STMicroelectronics Packaging and Testing Innovation Center publice aperuit in Area Core Bay in Valle Shenzhen-Hong Kong Scientia et Technologia Innovationis Cooperatio Zonae in Shenzhen Loop. Medium tendit ad fabricam, sarcinam et tentationem technologiarum integrandam, altissimam integrationem semiconductoris R&D et productionis promovendam, atque progressionem semiconductoris Sinarum industriae adiuvet. Senior executives STMicroelectronics, duces SEIFA Microelectronics Co., Ltd. et procuratores Investimenti Shenzhen tenentes Co, Ltd, caerimoniam aperiendam frequentavit.