Zhiwei Sensing successfully completed a new round of financing

Zhiwei Sensing has completed a new round of Series A financing, which was exclusively followed up by Tangxing Capital. The company will use the funds to further develop its MEMS chip product line and optimize the R&D and production of chips, modules and overall solutions to meet the needs of industries such as LiDAR, laser display, laser measurement and optical communications. At the same time, Zhiwei Sensing will continue to improve its camera model system in the field of dynamic structured light snapshot 3D vision, and work closely with downstream customers in the LiDAR industry to launch customized beam scanning core components and modules.