Zhongyin Microelectronics completed its B round of financing to accelerate the development of chiplet products

Recently, Zhongyin Microelectronics announced the completion of its B round of financing, with an amount exceeding RMB 100 million. This round of financing was led by SDIC Venture Capital, and old shareholders such as Zhuoyuan Capital continued to increase their investment. The funds raised will be mainly used for the research and development of enterprise-level high-speed interface IP and chiplet products to accelerate the rapid implementation of chiplet products and the introduction of talents.