Silergy Launches Next-Generation Ultra-High Power Density GaN Solutions

Silergy has launched a new generation of GaN solutions designed to improve efficiency and reduce heat. The solution integrates the controller with the GaN device, supports QR/DCM mode, simplifies the design, reduces PCB board occupancy, and reduces costs. Typical applications include the primary side sealed GaN chip SY50296 and the secondary side controller SY5238. These chips have high efficiency, high power density and comprehensive protection features.