TE Connectivity launches new FFC/FPC crimping technology

TE Connectivity (TE) has launched the NanoMQS miniaturized connector FFC/FPC crimping solution, which is used to connect the battery pack cell module to the BMS board. The solution uses a solder-free crimping process, which simplifies the assembly steps, reduces costs and saves space. Compared with traditional welding solutions, TE's solution reduces material usage, improves assembly efficiency, and reduces the risk of falling off in a vibration environment. In addition, the solution also supports the miniaturization and compact layout of components in new energy vehicle battery packs.