快报列表

Dear Secretary, Tesla recently launched the Dojo chip. It is understood that TSMC's excellent packaging technology - wafer integrated fan-out system (InFO_SoW) played an extremely critical role in it. So, I would like to ask whether your company currently has the technology to replace TSMC in this regard. If you do not currently have the technology to package Dojo, then what stage is your company's technology currently at? Thank you. 2024-12-31 19:45
About Jingwei Qili 2024-12-28 05:41
BiRen Technology and China Telecom and other partners released the intelligent computing heterogeneous quad-core mixed training solution 2024-12-26 21:05