Quectel Communications Launches New SiP-packaged Smart Cockpit Module AG855G

Quectel Communications recently released the new SiP-packaged smart cockpit module AG855G based on Qualcomm SA8155P, aiming to promote the development of smart cockpit technology. This module has powerful CPU and AI computing power, supports multi-screen integration, multi-mode intelligent interaction and other functions, and brings users a more comfortable driving experience. The smart cockpit market is expected to reach 103 billion yuan in 2025, and consumers are paying more and more attention to smart cockpits. Quectel Communications' AG855G module has been used in new models of multiple car brands.