The Zibo Core Material Integrated Circuit Packaging Substrate Project is expected to be officially put into operation in February

According to the news from China National Radio on January 19, 2024, the five main buildings of the first phase of the Zibo Core Material Integrated Circuit Packaging Substrate Project have entered the final stage, and the equipment is being installed and debugged. It is expected to be officially put into operation in February. The product positioning of this project is domestically leading, and after reaching full production, it will achieve domestic substitution of high-precision sealing loading boards.