Beiyi Semiconductor successfully trial-produced double-sided heat dissipation modules, and has the capacity to mass produce 750V-class IGBT modules and 1200V-class SiC modules

In November 2023, Beiyi Semiconductor successfully trial-produced the double-sided cooling module (DSC). After continuous optimization of processes and molds and reliability assessments, in March this year, Beiyi Semiconductor's 750V-level IGBT modules and 1200V-level SiC modules were able to be mass-produced, with packaging yields exceeding the industry level.