SK Hynix to use hybrid bonding technology to improve HBM storage performance

South Korean memory manufacturer SK Hynix plans to adopt hybrid bonding advanced packaging technology in HBM4e (16hi level) storage products starting in 2026. Analyst Ming-Chi Kuo believes that hybrid bonding technology will provide a higher level of advanced packaging density, enabling HBM storage systems to achieve stronger performance with lower power consumption, meeting the explosive AI training/inference computing power requirements of artificial intelligence server systems.