BE Semiconductor's hybrid bonding technology is favored by TSMC

The hybrid bonding advanced packaging technology of BE Semiconductor, a Dutch semiconductor equipment company, is widely adopted by chip manufacturers such as TSMC. Hybrid bonding is an innovative high-end bonding technology used to connect different cores and improve their performance. Analyst Ming-Chi Kuo predicts that by 2027, BE Semiconductor's hybrid bonding advanced packaging technology will bring in at least more than 500 million euros in revenue.