Glass substrate packaging technology leads the industry development

Glass substrate packaging technology is becoming a hot topic in the industry due to its high-frequency electrical characteristics, easy access to large-size ultra-thin glass substrates, low cost, simple process flow, mechanical stability and wide range of applications. This emerging vertical interconnection technology can achieve the shortest and densest connection between chips, and has unique advantages in the fields of RF chips, high-end MEMS sensors and high-density system integration.