Dongfeng Semiconductor adds IGBT substrate project

On April 8, Guangde Dongfeng Semiconductor Technology Co., Ltd. announced that it would invest in the construction of a project to produce 3 million copper-clad ceramic substrates per year for power semiconductors. The company is mainly engaged in the design, research and development, production and sales of high-performance ceramic-based copper-clad laminates for power semiconductors. Its products are widely used in IGBT power semiconductor modules, 5G radio frequency devices, electric vehicles and other fields. At present, Dongfeng Semiconductor's annual production capacity has reached 1.5 million high-performance ceramic-based copper-clad laminates.