Hon Hai Group plans to develop system-level packaging (SiP), high-speed optical fiber transceiver modules and automotive LiDAR packaging

Hon Hai Group will invest in Xunxin-KY to develop system-level packaging (SiP), high-speed optical fiber transceiver modules, and automotive laser radar (LiDAR) packaging. According to statistics, Foxconn Industrial Internet's investment in the semiconductor field has exceeded 10 billion yuan.