Cree Semiconductor promotes the construction of SiC packaging and testing production line

Core Semiconductor is promoting the upgrade of its third-generation semiconductor and other power device packaging and testing production lines, and launched the first phase of the IGBT and SiC basic process packaging and testing production line project in June. It is reported that after the project is put into production, it is expected to achieve an annual output value of 80 million yuan and a 25% increase in production capacity. The company's orders this year are saturated, and its products are mainly delivered to customers in the Pearl River Delta region.