Unigroup Guoxin launches 3D stacked DRAM technology to solve storage problems of high-computing chips

Unigroup Guoxin has launched a three-dimensional stacked DRAM (SeDRAM®) technology solution, which heterogeneously integrates 3D stacked DRAM and logic chips, providing ultra-large bandwidth and ultra-low power consumption, effectively solving problems such as the storage wall encountered by high-computing power chips.