Haining Liandongxin 6-inch microwave RF chip and device project is put into production

According to official news from Hangzhou Lian Microelectronics Co., Ltd. (hereinafter referred to as Lian Micro), the Haining Lian Dongxin 6-inch microwave RF chip and device project was officially put into operation on December 23. Haining Lian Dongxin was registered and established in 2021 and is a new production base project for Lian Micro's compound semiconductor RF chip business segment. The project has a total planned investment of 5 billion yuan, and will cover product areas such as 6-inch gallium arsenide microwave RF chips, gallium nitride (GaN HEMT) and vertical cavity surface lasers (VCSEL). After completion, it will reach an annual production scale of 360,000 6-inch microwave RF chips and devices.