快报列表

Eswin Computing's global R&D and marketing locations 2025-01-26 08:00
Anjian Semiconductor Power Semiconductor Module Packaging Project Signed and Settled in Zhejiang 2024-12-27 19:07
Tianjin Zhengxin Optoelectronics Semiconductor Laser Chip and Advanced Ceramic Packaging Materials Project Signed in Haining 2024-12-27 01:27
Qingxiangyue Precision Technology Co., Ltd. and Ningbo Lijin Technology signed a strategic cooperation agreement 2024-12-26 06:05
Haining Liandongxin 6-inch microwave RF chip project officially put into production 2024-12-25 22:18
Haining Liandongxin 6-inch microwave RF chip and device project officially put into production 2024-12-25 21:52
Wang Minwen, chairman of Lianwei Micro, said that the project has achieved a breakthrough from scratch 2024-12-25 21:52
Haining Liandongxin Project is the new base for Lianwei's compound semiconductor RF chip business 2024-12-25 21:51
Haining Liandongxin 6-inch microwave RF chip and device project is put into production 2024-12-25 20:59
The production capacity of the Hangzhou base of Lianwei reaches 90,000 pieces/year, and the Haining base is expected to be put into production in the fourth quarter of 2024 2024-12-25 11:25
New Micron Semiconductor Core Components Project Signed and Settled in Haining Economic Development Zone 2024-12-25 00:36
About Focuslight Technology 2024-01-10 00:00