Xinyang Silicon Diffusion Completes Over 100 Million Yuan Series B Financing

Recently, domestic semiconductor equipment company Xinyang Silicon Die completed its B round of financing with an amount of more than 100 million yuan. This round of financing was led by Guoxin Investment, followed by Shanghai Science and Technology Innovation and International Trade Industry Fund. Xinyang Silicon Die focuses on the research and development, production, sales and services of semiconductor wet process electroplating equipment and related wet process equipment. Its independently developed horizontal electroplating equipment can be applied to SiC and supports a variety of wafer sizes.