Hantian Tiancheng Electronic Technology is sprinting for an IPO on the Science and Technology Innovation Board, intending to raise 3.5 billion to expand production of silicon carbide epitaxial wafers

Recently, the IPO application of Hantian Tiancheng Electronic Technology (Xiamen) Co., Ltd. (hereinafter referred to as Hantian Tiancheng) on ​​the Science and Technology Innovation Board was accepted by the Shanghai Stock Exchange, and it plans to raise 3.5 billion yuan to expand the production capacity of silicon carbide epitaxial wafers. Hantian Tiancheng is a company specializing in the research and development, production and sales of silicon carbide epitaxial wafers, with a production capacity of 40,000 pieces per month. The company's chairman Zhao Jianhui is the actual controller of the company. Feng Gan, the head of the R&D team, has worked in many research institutions in Japan and has served as the company's vice president of R&D since 2011. Huawei's Habo Investment holds a 4.197% stake in Hantian Tiancheng.