Samsung Electronics wins 2.5D packaging order from Nvidia

South Korean electronics giant Samsung Electronics has successfully won Nvidia's 2.5D packaging order. Samsung's Advanced Packaging (AVP) team will provide Nvidia with Interposer (middle layer) and I-Cube, which is its self-developed 2.5D packaging technology. The production of high bandwidth memory (HBM) and GPU wafers will be handled by other companies.