快报列表

French technology company Iten collaborates with A*STAR Microelectronics Institute to develop solid-state battery technology 2025-05-19 20:40
Samsung may solve Nvidia's interposer shortage problem 2025-01-10 14:10
Qiangyi Semiconductor IPO raised 1.5 billion yuan for R&D and production projects 2025-01-03 20:23
Hello, could you please introduce your company's advanced packaging technology technology reserves in the post-Moore era? What is the production capacity planning? What is the room for improvement or enhancement in the current industry competition landscape? 2024-12-31 20:28
Hello, Secretary Dong! Is your company's silicon-free through-silicon via wafer-level ultra-high density packaging technology ready for mass production? 2024-12-31 20:04
The secondary market has always believed that the company has no technical barriers, so institutions look down on it. Is this true? Is the company's technical content very low? What are the advantages and barriers? 2024-12-31 19:51
Dear Secretary, Tesla recently launched the Dojo chip. It is understood that TSMC's excellent packaging technology - wafer integrated fan-out system (InFO_SoW) played an extremely critical role in it. So, I would like to ask whether your company currently has the technology to replace TSMC in this regard. If you do not currently have the technology to package Dojo, then what stage is your company's technology currently at? Thank you. 2024-12-31 19:45
Hello, Secretary Dong. May I ask what new layout has Changdian Technology made in terms of innovative technology research and development and new energy in the recent national 14th Five-Year Plan for scientific and technological development? Increasing investment in innovation is crucial to the company's development. We need to gradually move away from the single main business of assembly and packaging and testing. It is recommended that the company increase investment in technology research and development of new energy vehicle chips to make them bigger and stronger. In addition, it is recomm 2024-12-31 19:31
Hello, Secretary Dong, ① Are your high-density packaging technologies such as 3D stacking and TSV ready for mass production? If not, what stage is the development currently in? ② What are the gross profit margins and revenue share of your traditional packaging (through-hole insertion, surface mount) and advanced packaging (area matrix packaging, SiP, high-density packaging)? ③ Your company's revenue in the third quarter increased by 19% year-on-year, but net profit attributable to shareholders increased by 99% year-on-year. What is the main reason for the increase in net profit in the third qu 2024-12-31 19:20
Dear Secretary, hello. The company has the largest patent reserve in the domestic packaging and testing industry, but its gross profit is slightly lower than other companies in the same industry. What kind of advantages does the company's numerous patent technologies reflect? Are there any technologies that other domestic companies cannot do? 2024-12-31 18:52
Hello, Secretary Dong, Huawei recently launched the "stacked packaging" patent. I would like to ask if your company has any similar technical accumulation. 2024-12-31 18:25
Is your company one of the top ten chip packaging and testing companies in the world? In terms of advanced packaging technology, have you achieved full coverage of mainstream technology platforms? Thank you 2024-12-31 18:06
Could you please tell me about Changdian Technology’s R&D and application of chiplet technology? 2024-12-31 17:56
The dividend of 2 yuan for every 10 shares is still too low. I think at least 10 yuan for every 10 shares should be enough, so that the executives can justify their tens of millions of annual salaries! ! 2024-12-31 17:52
It is rumored that your company is cooperating with several leading chip manufacturers in China to produce chips containing chiplet technology. Is this true? 2024-12-31 17:24