SK Hynix receives $458 million in funding to build an AI chip advanced packaging production base in the United States

The U.S. government announced that it will provide SK Hynix with $458 million in direct funding. The funds will be used to support SK Hynix's construction of a memory packaging plant and advanced packaging R&D facilities for artificial intelligence (AI) products in West Lafayette, Indiana. SK Hynix expects that the Indiana plant will begin mass production of next-generation HBM and other AI-friendly memory products in the second half of 2028.