Financing situation of Zhenqu Technology

2024-12-26 04:30
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Zhenqu Technology has completed 9 rounds of financing, many of which were used for the research and development of SiC power modules. The most recent round was a round D financing of over 600 million yuan completed on October 9, 2023, led by Yuanhe Chenkun and Legend Capital. The funds raised this time will be mainly used to supplement operating cash flow during the business explosion phase, expand production capacity, and develop next-generation power modules, power bricks and silicon carbide technology.