Zibo Core Material Integrated Circuit Co., Ltd. Completes A+ Round of Financing

Zibo Xincai Integrated Circuit Co., Ltd. recently successfully completed a round of A+ financing of several hundred million yuan, and the funds raised will be mainly used for production line construction. The company was established in 2021 and focuses on the production of high-precision, high-end chips and substrates in the field of advanced packaging, such as FC-CSP, SiP, AiP, FC-BGA, etc. These products are widely used in many fields such as PCs, servers, mobile phones, consumer electronics and portable equipment.