VeriSilicon actively promotes the development of chiplet technology and helps domestic automotive chip industry break through

VeriSilicon is actively promoting the development of chiplet technology to help the domestic automotive chip industry achieve new breakthroughs. They are developing high-performance computing/automotive client chips based on the chiplet architecture and have completed the CoWoS packaging design project. In addition, they have launched a UCIe/BoW-compatible physical layer interface and are launching a chiplet intelligent driving system chip design platform. At the same time, VeriSilicon is also actively promoting the application and development of panel-level packaging technology.