Taiwan-based ASE wins Apple M4 chip advanced packaging order

Taiwan-based ASE Semiconductor Co., Ltd. recently received an advanced packaging order for Apple's M4 chip. ASE has maintained a long-term cooperative relationship with Apple and has provided chip packaging and testing and SiP system-level packaging services for Apple. This time, Apple separated the advanced packaging and chip foundry orders, and ASE has become a major customer of its advanced packaging capacity. It is reported that ASE will be responsible for the 3D packaging integration of the M4 processor and DRAM memory, and production is expected to begin in the second half of this year.