AMD considers adopting the universal chiplet high-speed interconnect standard "UCIe"

Processor giant AMD is reportedly considering using the universal chiplet high-speed interconnection standard "UCIe" jointly initiated by technology giants such as Intel in its chips. AMD Senior Vice President and Corporate Fellow Sam Naffziger and Chief Technology Officer Mark Papermaster said that AMD is considering using the UCIe standard to establish a chiplet ecosystem to improve connectivity performance, reduce latency and power consumption. Although AMD's current EPYC, Ryzen, and Instinct MI300 series chips all use self-developed Infinity Fabric technology for chiplet interconnection, the technology has latency and energy efficiency issues. Despite this, AMD has a vibrant team of engineers who know how to solve these problems. AMD plans to launch a lightweight chiplet interconnect technology to further reduce latency. This connection technology will be used in the chiplet architecture of AMD's new generation of EPYC and Ryzen processors. However, since Infinity Fabric is AMD's proprietary technology and is not available to other third-party manufacturers, this may cause compatibility issues between AMD's chiplets and other third-party chiplets when interconnected.