Chixin Semiconductor recently announced the completion of its A+ round of financing

Changsha Chixin Semiconductor Co., Ltd. (hereinafter referred to as Chixin Semiconductor) recently announced the completion of its A+ round of financing, which was jointly participated by Kunshan Hi-Tech Group and Hunan Xingxiang Capital. The company is committed to the research and development of low-power IoT chips, and has a number of key technologies required for UWB chips, such as low-power and high-performance communication baseband IP, high-precision positioning IP and analog RF IP. It not only provides users with high-performance UWB chip products, but also provides turnkey solutions and services. Chixin Semiconductor's UWB chip products CX100, CX310 and CX500 series have been mass-produced, and have established cooperation and shipments with leading customers in the fields of consumer electronics, Internet of Things, automotive electronics, etc., occupying a leading position in the market and enabling a variety of client applications (such as mobile phones, tags, digital keys, sentinel radars, kick radars, breathing detection, CPD, etc.).