Zhengda Semiconductor's SiC substrate project settled in Zhejiang with a total investment of 1.2 billion yuan

On March 31, at the signing ceremony of the investment promotion project in Tonglu Economic Development Zone, Zhejiang Province, Zhengda Semiconductor's "Laser Cutting Equipment and Annual Production of 1 Million SiC Substrates Project" was officially signed and settled in Tonglu Economic Development Zone. Zhengda Semiconductor is a high-tech company engaged in the research and development and manufacturing of laser cutting equipment and fully automatic laser slicing and polishing of SiC ingots. The total investment of the project is 1.2 billion yuan, and the cumulative output value in the five years from 2025 to 2029 will not be less than 2.2 billion yuan.