SK Hynix will use TSMC's 3nm process to produce customized HBM4 memory

According to reports, in order to meet the needs of important customers, SK Hynix, a major Korean memory chip manufacturer, plans to use TSMC's 3nm process to produce customized sixth-generation high-bandwidth memory HBM4 for customers from the second half of 2025. It is reported that SK Hynix has decided to cooperate with TSMC and will launch a vertically stacked HBM4 prototype product based on TSMC's 3nm process as early as March next year. The main customer is NVIDIA. HBM4 will use a logic base die instead of a traditional DRAM base die to improve performance and energy efficiency. This logic base die is located at the bottom of the DRAM and mainly serves as a controller between the GPU and memory. It allows customers to customize their designs and add their own intellectual property (IP), which helps to customize HBM and further improve the efficiency of data processing. This is expected to reduce power consumption by about 30%.