Kexin Microelectronics Chip Design Headquarters Project Signed in Qingdao

On April 26, the Kexin Microelectronics Chip Design Headquarters Project was officially signed in Qingdao Integrated Circuit Industrial Park. The project was invested and constructed by Qingdao Kexin Microelectronics Technology Co., Ltd. with a total investment of 900 million yuan, mainly to build a power semiconductor product R&D center and a testing center.