Nippon Electric Glass and Via Mechanics Sign Cooperation Agreement to Jointly Develop Semiconductor Packaging Glass Substrates

Nippon Electric Glass Co., Ltd. (NEG) announced on November 19, 2024 that it has signed a joint development agreement with Via Mechanics, Ltd. to accelerate the development of glass or glass-ceramic substrates for semiconductor packaging. At present, semiconductor packaging mainly uses organic materials such as glass epoxy substrates, but in the face of higher demand for high-end semiconductor packaging such as generative AI in the future, core layer substrates and micro-machined holes with electrical properties are required. Since organic material substrates cannot meet these requirements, glass has attracted attention as an alternative material. However, ordinary glass substrates are prone to cracking when drilling with CO₂ lasers, increasing the risk of damage to the substrate, making laser modification and etching to form through holes difficult and time-consuming. To solve this problem, NEG has partnered with Via Mechanics to combine NEG's expertise in glass and glass ceramics with Via Mechanics' laser technology to introduce its laser processing equipment in order to quickly develop glass substrates suitable for semiconductor packaging.