TSMC plans to expand SoIC 3D stacking technology capacity

To meet the demand for SoIC advanced packaging, TSMC plans to increase its SoIC 3D stacking technology capacity by 8 times in the next three years. It is expected that by the end of 2026, SoIC capacity will increase 8 times compared to 2023. TSMC said that in the next few years, advanced packaging SiP for high-demand applications such as AI and HPC will use both CoWoS and SoIC 3D stacking technologies.