Glass substrate TGV technology has obvious advantages and is widely used in many fields

Compared with traditional through silicon via (TSV) technology, glass substrate TGV technology has obvious advantages, including excellent high-frequency electrical properties, easy access to large-size ultra-thin glass substrates, low cost, simple process flow, strong mechanical stability, etc. These advantages make glass substrate TGV technology widely used in sensors, CPUs, GPUs, AI, display panels, medical devices, semiconductor advanced packaging and other fields.