快报列表

Mr. Secretary, does your company have mastered the through silicon via (TSV) technology? 2024-12-31 20:10
The secondary market has always believed that the company has no technical barriers, so institutions look down on it. Is this true? Is the company's technical content very low? What are the advantages and barriers? 2024-12-31 19:51
Dear Secretary, Tesla recently launched the Dojo chip. It is understood that TSMC's excellent packaging technology - wafer integrated fan-out system (InFO_SoW) played an extremely critical role in it. So, I would like to ask whether your company currently has the technology to replace TSMC in this regard. If you do not currently have the technology to package Dojo, then what stage is your company's technology currently at? Thank you. 2024-12-31 19:45
Hello, Secretary Dong. May I ask what new layout has Changdian Technology made in terms of innovative technology research and development and new energy in the recent national 14th Five-Year Plan for scientific and technological development? Increasing investment in innovation is crucial to the company's development. We need to gradually move away from the single main business of assembly and packaging and testing. It is recommended that the company increase investment in technology research and development of new energy vehicle chips to make them bigger and stronger. In addition, it is recomm 2024-12-31 19:31
Dear Secretary, hello. The company has the largest patent reserve in the domestic packaging and testing industry, but its gross profit is slightly lower than other companies in the same industry. What kind of advantages does the company's numerous patent technologies reflect? Are there any technologies that other domestic companies cannot do? 2024-12-31 18:52
Hello, Secretary Dong, Huawei recently launched the "stacked packaging" patent. I would like to ask if your company has any similar technical accumulation. 2024-12-31 18:25
Could you please tell me about Changdian Technology’s R&D and application of chiplet technology? 2024-12-31 17:56
It is rumored that your company is cooperating with several leading chip manufacturers in China to produce chips containing chiplet technology. Is this true? 2024-12-31 17:24
Samsung released GDDR6W video memory at the end of last month, saying that its bandwidth and capacity have doubled, and introduced the new GDDR6W video memory: using fan-out wafer-level packaging (FOWLP) technology, it greatly improves memory bandwidth and capacity. Does Changdian Technology have FOWLP packaging technology? Does your company have a cooperative relationship with Samsung? Does your company currently have a video memory packaging business? 2024-12-31 16:35
Tesla's Dojo supercomputing platform will be put into mass production in July. It uses fan-out wafer-level packaging technology. Does the company have this technology? 2024-12-31 12:53
Dear Secretary, Hello, HBM (high-performance bandwidth) and advanced packaging technology have been widely used in artificial intelligence recently, which has greatly improved the performance of AI acceleration chips. 1. As a leading packaging and testing company in China, what is the current level of stacking technology that the company can achieve? 2. Does the company have any cooperation with leading domestic companies such as Huawei HiSilicon and Yangtze Memory in the field of advanced packaging? 2024-12-31 11:38
Zhuhai Tiancheng Advanced Semiconductor Technology launches new technology platform 2024-12-31 01:54
NAND Flash market is weak, some production lines turn to DRAM 2024-12-27 19:32
Glass substrate TGV technology has obvious advantages and is widely used in many fields 2024-12-27 11:43
TGV companies will accelerate their layout in the second half of 2024 2024-12-27 07:02