Samsung Electronics accelerates expansion of domestic packaging production base in South Korea

Samsung Electronics is accelerating the expansion of its packaging production base in South Korea. Recently, the company signed an investment agreement with South Chungcheong Province and Cheonan City to expand semiconductor packaging process facilities. The agreement includes the construction of an advanced packaging facility for HBM on 280,000 square meters of land in Cheonan City leased from Samsung Display, which is expected to be completed by the end of 2027. Samsung Electronics currently has packaging production bases in Cheonan City and Onyang Park. Due to continued facility investment, the Onyang Park has reached saturation, prompting the company to consider establishing a new HBM mass production packaging line in Cheonan.