Anjian Semiconductor Power Semiconductor Module Packaging Project Signed and Settled in Zhejiang

On May 20, Anjian Semiconductor announced that its "Power Semiconductor Module Packaging Project" was signed and settled in Haining Economic Development Zone, Zhejiang, with a total investment of 100 million yuan. The project aims to build an automotive-grade IGBT and SiC module packaging production line. Anjian Semiconductor was established in July 2021. It has currently achieved mass production of three product lines: IGBT, SGT-MOS, and SJ-MOS, and has launched a 1200V-17mΩ SiC MOSFET with fully independent intellectual property rights.