2.5D and 3D packaging technologies drive the development of the semiconductor industry

As a key means to improve chip performance and functional density, 2.5D and 3D packaging technologies are driving the rapid development of the semiconductor industry. These two technologies improve the overall performance of the system while reducing power consumption by achieving high-speed interconnection and short-distance communication between chips. In the future, with the continuous advancement of technology and the continuous expansion of market demand, 2.5D and 3D packaging technologies will play a greater role in the semiconductor industry.