Blackwell platform B100 bare die size doubles, TSMC's total CoWos capacity to increase 150% annually in 2024

The bare die size of the B100 product belonging to the Blackwell platform is twice that of the H100. It is expected that TSMC's total CoWos production capacity will increase by 150% annually in 2024. After becoming mainstream in 2025, the annual growth rate of CoWos production capacity will reach 70%, of which NVIDIA's demand accounts for nearly half.