Currently, all major AI chips on the market use advanced packaging technology. With the continuous development of AI applications, what innovative opportunities will it bring to the chip packaging industry?

Changdian Technology: Dear investors, hello. For core chips for high-performance computing, the industry is currently focusing on chiplet technology to achieve microsystem integration, thereby building high-density computing clusters with higher computing density and better cost. Packaging innovation is becoming increasingly important for promoting the development of high-performance computing, and is reflected in the following three aspects. First, through 2.5D/3D packaging, including the development of artificial intelligence applications based on redistribution layer (RDL) adapters, silicon adapters or silicon bridges, and large-size flip-chips, to achieve higher density on chiplets and higher interconnection speeds within microsystems. Second, through system/technology co-optimization (STCO), develop devices with microsystem-level integration such as chiplets. STCO divides and reintegrates the chip architecture at the system level, using high-performance packaging as a carrier, running through design, wafer manufacturing, packaging and system applications to meet more complex AIGC application requirements. Third, through SiP, a higher level of heterogeneous integration can be created, giving different types of chips and components (including passive components) greater flexibility, and realizing mixed packaging of multiple packaging types. Facing the needs of high-performance computing, Changdian Technology actively cooperates with industry chain partners to continuously launch innovative solutions to better meet market application needs. Thank you for your attention to the company.